Processes

This is a brief description of our Electroless Nickel per ASTMB733 process:

• Nickel plated uniformly ideal for small, tight board features, provides a diffusion barrier for copper migration and excellent soldering properties
• Combined with immersion gold, this provides a replacement for HASL finishes and is necessary for thicker boards (>.080 inches)
• Minimum thickness recommended is 100 microinches

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