Processes

This is a brief description of our Gold per Mil-G-45204/ASTMB-488-95 process:

• Electrolytic gold is used for minimum contact resistance and gold wire bonding
• Hard (Knoop 130-200) gold (Mil-G-45204 Type I/ASTM B-488 Type 2) is applied to connector tabs requiring wearability and lubricity.
• Minimum thickness recommended is 30 microinches.
• Soft (bondable (Knoop <90) gold (Mil-G-54204 Type III/ASTM Type 1) is used when gold wire bonding is required.
• The bath  is highly purified, tested for purity and hardness and wire bond tested monthly.
• Minimum thickness recommended is 30 microinches (thermosonic wire bonding) and 5 microinches (ultrasonic wire bonding)

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