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Home > Pre-plating Ops

Pre-plating Ops

Superior Processing can plate panels larger than 18x24. Please call to discuss.

Requirements for a successful job follow:

Electroplating

  • All exposed surfaces should have connection (bussing) to the edge of the panel.
  • Dry film resists should be applied on clean copper according to the manufacturer's processing requirements.
  • Use proper resists for hard or soft gold.
  • Tin and tin-lead needs to be throughly removed and the copper surface clean prior to nickel and gold plating.
  • Include thickness requirements with paperwork.

Electroless Nickel / Immersion Gold (ENIG)

  • Soldermask should be cured according to manufacturer's process requirements.
  • Panels pumice scrubbed prior to soldermask seem to have less problems.
  • Developing/rinsing of soldermask should be done correctly.
  • Any physical clean prior to shipping for ENIG plating is beneficial.
  • Dry film resists cannot be run through ENIG.

Immersion Silver

  • See requirements for ENIG.
       Note:  Immersion silver displaces copper. Any contamination on the copper surface will not plate.
  • Dry film resists can be run through immersion silver.

Electroless Gold

  • See requirements for ENIG.