Pre-plating Ops

Electroplating

• All exposed surfaces should have connection (bussing) to the edge of the panel.
• Dry film resists should be applied on clean copper according to the manufacturer's processing requirements.
• Use proper resists for hard or soft gold.
• Tin and tin-lead needs to be throughly removed and the copper surface clean prior to nickel and gold plating.
• Include thickness requirements with paperwork.

• Soldermask should be cured according to manufacturer's process requirements.
• Panels pumice scrubbed prior to soldermask seem to have less problems.
• Developing/rinsing of soldermask should be done correctly.
• Any physical clean prior to shipping for ENIG plating is beneficial.
• Dry film resists cannot be run through ENIG.

• See requirements for ENIG.
     Note:  Immersion silver displaces copper. Any contamination on the copper surface will not plate.
• Dry film resists can be run through immersion silver.

• See requirements for ENIG.