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January 2010
Superior Processing Launches
New Website
March 2010
Superior Processing implements silver and tin/gold alloy plating for special soldering applications
June 2010
Implemented palladium plating to provide more options for our customers
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Brief Description:
- Typically for printed circuit board applications palladium is plated on a nickel or copper base. The palladium is applied on the base followed by a soft gold over plate. Palladium has very good solder ability characteristics and is wire bondable so the final gold thickness can be reduced. Palladium has a knoop hardness up to 400 so it is an excellent choice in electrical contact applications where contact wear is a concern.
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