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January 2010
Superior Processing Launches
New Website
March 2010
Superior Processing implements silver and tin/gold alloy plating for special soldering applications
June 2010
Implemented palladium plating to provide more options for our customers
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This is a brief description of our Immersion TIn process:
- Immersion Tin is deposited directly on copper. It is used to achieve solderable surfaces and can be used for press fit connections and ZIF edge connectors.
- Our Immersion Tin meets the requirements of IPC-4554. Typical thickness is 40 uin minimum. More tin can be applied but due to the nature of the chemistry it can negatively affect soldermask and legend coatings.
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