Excellence in Precious Metal PCB Plating
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January 2010
Superior Processing Launches
New Website

March 2010
Superior Processing implements silver and tin/gold alloy plating for special soldering applications

June 2010
Implemented palladium plating to provide more options for our customers
Technical Information
Hard Gold/Soft Gold
 

This is a brief description of our Gold process:

  • Electrolytic gold is typically used for minimum contact resistance, connector tabs requiring wear-ability and lubricity, or for gold wire bonding.
  • Our Hard Gold meets the requirements of MIL-DTL-45204 and ASTM B 488, Types 1 and 2, Code C with a hardness range of 130-200 Knoop.  The Gold purity is a minimum of 99.7%.  Typical Hard Gold thickness's range between 5-200 uin.  Most contact fingers require 30-50 uin.
  • Our Soft Gold meets the requirements of MIL-DTL-45204 and ASTM B 488, Type 3, Code A with a hardness range of 90 Knoop maximum.  The Gold purity is a minimum of 99.9%.  Typical Soft Gold thickness's for wire bonding range between 10-100 uni depending on thermosonic or ultrasonic wire bonding applications.
  • Our baths are highly purified and tested for purity and hardness monthly.  Our Soft Gold is wire bond tested monthly.
 
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