This is a brief description of our ENEPIG process:

• ENEPIG is a coating often referred to as the "universal finish".  That is because it can be soldered or wire bonded with the same coating.  It also provides a barrier between the electroless nickel and the immersion gold which prevents nickel corrosion or the dreaded "black pad".
• IPC is currently working on a specification to cover this surface coating.
• Typical thickness's are 100-150 uin nickel, 4-8 uin palladium, 1-2 uin gold.  With designs that require wire bonding only thicker deposits of palladium in the 8-15 uin range can provide a robust wire bond.