This is a brief description of our Electro-less Gold process:

• This gold is a true electroless deposit that can build up the immersion gold thickness above 5 uin.  When a thicker gold is needed on an ENIG design we can go this bath after the ENIG cycle.  The gold is a soft gold with purity above 99.9% and is wire bondable.  Soldermask can go into this bath without attack.
• For wire bonding we typically see thickness's from 30-50 uin.
• Note: This gold type reaches a deposit plateau at around 50 uin.  It is difficult to exceed 60 uin.