Electroless Nickel/Immersion Gold (ENIG)

"Our process advantages - start-to-finish"

• Process developed in Japan
• Cleaner neutralizing step
• Improved microtech (excellent leveling)
• Pre- and post- acid dips for catalyst (eliminate background plating)
• PCB industry formulated electroless nickel bath (with successful track record)
• Robust EN controller
• Improved immersion gold bath (displacement + autocatalyic)
• Extensive rinsing between process steps
• Excellent reliable final finish
• AI-wire bondable (AU-wire bondable in Japan)
• Automatic plating line
• Industry and technical experience